| Plating Services Nadcap Criteria for Chemical Processing - AC7108 Rev B Anodizing, Chemical Conversion, Electroless Nickel, Passivation, Copper, Gold, Electrolytic Nickel |
We Are Now ISO 9001:2000 & SAE AS9100 B Registered and BAE Systems (United Defense) Approved
Plating Available On All Metal Substrates Including:
Titanium, Tantalum, Niobium, Molybdenum,
Magnesium, Inconel, Nickel Alloys, Graphite
Plating Processes
Copper per Mil-C-14550, AMS 241F & MIL-P-47226
Electroless Nickel per Mil-C-26074, AMS-C-26074, AMS 2404 & 580-5296-001
High Phos. Electroless Nickel per ASTM B733, RO56A201, 952-0766-001 & 580-0766-001
Electro. Nickel (Bright & Matte) per QQ-N-290, AMS-QQ-N-290, Mil-P-27418 & 580-0070 PTF (Teflon Nickel) per 5982305
Gold per Mil-G-45204, AMS B 488-01, AMS 2422D & 580-0143-00 (Including Deep and Immersion for Printer Circuit Boards)
Silver per QQ-S-365, ASTM B700 & AMS2412 (Matte, Sulfur Free Semi-Bright, Bright)
Tin (Matte & Bright) per Mil-T-10727, ASTM B 454 (Acid & Cyanide)
Immersion Tin for Printed Circuit Boards
Tin Lead (Bright 90 / 10 & 60 / 40) per Mil-P-81728
Alkaline Bismuth Tin per Mil-T-10727, 580-0151 & 580-0225
Cad. per QQ-P-416F, AMS-QQ-P-416 & AMS 2400(Clear, Yellow, Olive Drab Chromate)
Conversion & Other Processes
Electropolish-Stainless Steel, Aluminum, Copper Alloys
Chem. Film / Irridite per Mil-C-5541E, Mil-DTL-5541, AMS 2473 & 580-0036Class IA & III
Anodize per Mil-A-8625F, AMS A-8625, AMS 2472 & 580-0008 Type II & III (Clear, Black, Yellow, Gray, Blue, Red, Green, Blue / Gray, Purple)
Passivation on Stainless Steel QQ-P-35, ASTM A967& AMS 2700
Passivation Titanium
Black Oxide on Copper Alloys per Mil-F-495E
Heat Treat of Beryllium Copper
Chemical Film for Copper and Copper Alloys 580-0034-000
Teflon Impregnated Anodize, Anodize On Titanium Per AMS2488C
Bright AnodizeNew: Hydrofluoric Acid Etching
Coming Soon: Anodize per Mil-A-8625F Type I
Mechanical Finishing
Tumbling, Sand Blasting
Some of the services include precious and non-precious metal plating on precision component parts. Using the latest technology and special handling equipment for extremely small and / or delicate parts, we provide immersion tin, immersion gold, and deep gold services to the printed circuit board industry.
Industries Served
| • Aerospace | • Telecommunications |
| • Medical | • Defense |
| • Electronics | • Computer |
| • Special Equipment Customers |
Capabilities
| • Advanced Plating Processes | • Engineering Assistance |
| • Fully Equipped Lab | • Custom Masking & Racking |
| • Stock to Dock | • Part Marking |
| • Custom Packaging & Shipping | • Laser Etching |
Testing Capabilities
Conductivity, Salt Spray, Porosity, Humidity, Solderability,
Bend & Scrape, Surface Roughness
NEW! NEW! NEW!
We now have the latest in analytical testing equipment.
Our newly acquired PerkinElmer Inductively Coupled Plasma instrument provides automatic analysis and documentation of all plating baths and waste streams. This equipment adds real time responsiveness to our traditional atomic absorption capability.
Additional Testing Equipment
